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SCHOLARSHIP
OBJECTIVE
  • The purpose of the scholarship is to support and provide educational opportunities for deserving and outstanding young Malaysians
  • To provide graduate-employability and serve as a talent supply chain for developing young leaders for the Group.
 
POLICY
The scholarship is open to financially needy and academically inclined Malaysian students including children of employees who are currently pursuing or intend to pursue a full time first Degree in local public / private universities in any of the following disciplines:
  1. Built Environment (Quantity Surveying / Land Surveying / Building @ Construction Management)
  2. Engineering (Civil and Structure)
  3. Courses related to the above
    • Full tuition fees and living expenses for successful applicants amounting to RM15K per academic year or RM60K for all degree courses.
    • The Scholarship is only applicable for Bachelor’s degree courses and does not apply for Master’s degree course.
    • Systematic Young Leaders Programme will be provided.
    • To serve a 3-year bond with the Company upon graduation.
    • Must achieve and maintain a minimum CGPA of 3.33 per academic year during the scholarship programme.
 
ELIGIBILITY
  1. Malaysian citizen aged 23 years and below.
  2. Applicants currently waiting for admission or already admitted to pursue a full time Bachelor’s degree in local public / private university. The public / private university must have been established under the Universities and University College Act 1971 (Act 30), Universiti Technologi Mara Act 1976 (Act 173) or the Private Higher Education Institutions Act 1966 (Act 555).
  3. 1st year students in the 1st semester are encouraged to apply.
  4. Applicants must achieve the following pre-university qualifications.
    • SPM: minimum 5As, or STPM: minimum 2As + 3Bs, or Matriculation / Diploma / A-Levels: minimum CGPA 3.33
    • Current 1st, 2nd or 3rd year university students minimum CGPA 3.33
  5. Applicants with outstanding extra-curricular record will have an added advantage.
  6. Family (parents or guardians) household income not exceeding RM10,000 per month.
  7. Currently not a recipient of any scholarship loan or financial aid from any other organization.
 
APPLY NOW
  1. All scholarship application forms and supporting documents must be submitted online on or before 31th Dec, 2023.
  2. Applications are to be completed with the following required information. Incomplete applications will be rejected.
    1. Personal Particulars
    2. Educational Background
    3. Information on Course Applied / Current Course
    4. Parents / Guardian Particulars
    5. Siblings Background
    6. Other Scholarship Applied
  3. Applicants must submit the following supporting documents with their application forms which can be downloaded by logging into www.llc-bhd.com.my
    1. Passport-sized photograph not more than 6 months old & copy of MyKad
    2. Education certificates (SPM, STPM / A-Level and / or Diploma certificates, university acceptance / offer letter, latest CGPA, etc.)
    3. Applicants’ co-curricular / extra-curricular activities, achievement and certificate.
    4. Parent’s / Guardian’s Income tax J-Form / Payslip / Pension Card / Parent(s) Death Certificate.
  4. Only shortlisted applicants will be notified via TELEPHONE for an interview hence, please ensure Your telephone number is accurate and contactable.
 
TERMS & CONDITIONS
1.0 : The LLC Scholarship Programme
  • The LLC Scholarship Programme is an annual programme to support and provide educational opportunities for deserving outstanding young Malaysians.
  • We provide graduate-employability whereby these young graduates will be mentored and trained to become our young leader.
  • Full tuition fees and living expenses for successful applicants amounting to RM15,000 per academic year (up to 4 years) or RM60,000 for full degree course.
  • Willing to serve the Company for 3 years upon graduation.
  • Must complete the full degree course and achieve min CGPA of 3.33 per academic year to maintain the scholarship.
     
2.0 : General Terms and Conditions
     
2.1 : Field of Study
  • The scholarship is open to financially needy and academically Malaysia students including children of LLC employees who are currently pursuing or intend to pursue a full time First Degree in local public/private universities in any of the following disciplines:
    1. Built Environment (Quantity Surveying/Land Surveying/Building @ Construction Management)
    2. Engineering (Civil and Structural)
     
2.2 : Eligibility
  1. Malaysia citizen aged 23 years and below.
  2. Applicants currently waiting for admisdsion or already admitted to pursue a full-time degree course in local public/private university.
  3. Applicants currently in their 1st, 2nd & 3rd yrs of undergraduate studies may apply.
  4. Applicants must achieve the following pre-university qualifications:
    • SPM: min 5As, or STPM: min 2As + 3Bs, or Matriculation/Diploma/A-Level: min CGPA 3.33
    • Current 1st, 2nd or 3rd yrs university students: min CGPA 3.33
  5. Applicants with outstanding extra-curricular record will be advantageous.
  6. Family household income not exceeding RM10,000 per month.
  7. Curently not a recipient of scholarship, loan or financial aids from any other organizations.
  8. Successful applicants and 2 respective guarantors are required to enter the bond agreement with the Company.
  9. All decision made by the Committee are final. No appeals will be entertained.
  10. Only short-listed applicants will be notified by telephone call for an interview.
  11. The short-listed applicants must bring along his/her original certificates during the interview.
     
3.0 : FAQ
     
3.1 : Do I need to be accepted by a university before apply?
No, applicants who are awaiting admission/acceptance to a university may also apply as scholarships will be awarded once applicants have gained acceptance to the university.
     
3.2 : What are the unievrsities accepted by LLC?
Local public or private universities - Tier 4 & 5 as in SETARA listing. You may verify your course via the following links: Malaysian Qualifications Agency at http://www.mga.gov.my/.
     
3.3 : Do you accept manual application?
No, only application submitted online at www.llc-bhd.com.my/scholarship will be accepted. Please refrain from submitting any form of hard copy application as it will not be entertained.
     
3.4 : Am I allowed to switch my area of study?
No.
     
3.5 : Can I accept additional financial aid from other organizations after I have been awarded the LLC scholarship?
No.
     
3.6 : Is there any bond and for how long?
Yes, a scholar will need to serve a 3 years bond with LLC Group. The bond will commence after fulfill our minimum 6 months "fresh grad development programme".
     
3.7 : If I do not complete the course or fail to achieve the min CGPA 3.33 per academic year, do I need to repay LLC?
Yes, you will need to repay the total amount disbursed by LLC plus 8% interest per annum upon graduation.
     
3.8 : When can I check my application status?
You will be notified by telephone call followed by letter of scholarship award after attended the interview. Therefore, please ensure that all contact details provided in the application form are accurate.
     
Agree to Terms and Conditions